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Signal Integrity and Board Design

 
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Course Number553
Price NIS before VAT / Tcs5040 / 12
Duration (Days)3
LanguageEnglish / Hebrew
Level 
JanFebMarAprMayJun
08-10     22-24
 
JulAugSepOctNovDec
    30 02
+972 3 9247780 ext. 207
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The 3-day workshop “Signal Integrity and Board Design” is aimed at developers who want to implement high-speed interfaces between a XILINX FPGA and external semiconductor components and who want to design complex high-speed FPGA at board level. This Workshop is designed for developers who not only design FPGAs but also systems and the layout.

The first part of this course tackles the signal integrity issues in general. You will learn to judge when signal integrity is important and relevant, to interpret, for example, IBIS models, and to select appropriate termination procedures. Signal refection and crosstalk effects are described and demonstrated by simulation. Simulation examples are given for common memory interfaces as well as for MGT interconnection. You will learn how to implement high-speed buses, including clock design, loading and signal termination. Furthermore, the power distribution and bypassing design are main topics.

The second part of this course covers the board design. With the availability of the Virtex-4 and Virtex-5 families, FPGA designers face new implementation possibilities and challenges.

Many different interfaces to external components allow a vast variety of application areas. The high data rates that Virtex-4 and Virtex-5 are able to handle require in depth knowledge about the physical design around the FPGA. Based on the power requirements of the FPGA, solutions for power supplies are presented. Termination schemes that are necessary for high clock and data rates are discussed broadly. In that context the different signal levels and termination variations are covered. A special chapter discusses the clock supply as well as connecting to high speed components on the board. Moreover, rules for designing PCBs will be commented on.

 

Signal Integrity

  • Transmission Lines
  • IBIS Models and SI-Tools
  • Reflections and Crosstalk
  • SI Analysis
  • SI and Power Supply
  • Labs using HyperLynx

Board Design

  • Virtex FPGAs Power Supply
  • Configuration and PCB
  • Signal and Clock Interfacing for SelectIO as well as RocketIO
  • PCB Modeling and Simulation
  • Thermal Aspects
  • Board Design Rules
  • Labs

Course Content

Introduction Signal Integrity

  • Transmission Lines
    • Basics
    • Critical Trace Length
    • What is “High Speed”?
    • Transmission Lines
  • IBIS Models and SI-Tools
    • What are IBIS Files?
    • IBIS Editor
    • The XILINX IBIS Model
    • SI Tools
    • HyperLynx
    • Lab: Invoking HyperLynx
  • Reflections
    • Reflection Effects
    • Reflection Calculations
    • Trace Termination
    • Reflections on Different Topologies
    • Lab: Reflection
  • Crosstalk
    • Crosstalk Basics
    • Crosstalk Calculations
    • Minimizing Crosstalk
    • Lab: Crosstalk
    • Add on: Extended lab Xtalk
  • Signal Integrity Analysis
    • Methods for SI Analysis
    • Further Components
    • General Overview
    • Package Modeling
    • Via Modeling
    • System Analysis
    • General Overview
    • XILINX RocketIO SI Design Kits
    • Memory Interface Analysis
    • DDR/DDR2 Design Kits
  • Power Supply Issues
    • Power Supply Impedance
    • Bypass Capacitors
    • Power Supply Inductance
    • SI on Board Level
    • Tool Support
 

Board Design Overview

  • FPGA Power Supply
    • Power Supply Design Flow
    • Power Supply Estimation
    • Supply Voltages Generation
    • Power Distribution and Bypassing
    • Special: VREF
    • Power Supply Simulation Tools
    • Special: MGT Power Supply
    • Special: System Monitor Supply
  • Lab: Power Prediction
  • Configuration and PCB
    • Configuration Interfaces
    • Configuration Memory
    • Configuration Applications
  • Signal Interfacing
    • FPGA I/O
    • Combining High-Speed I/O Standards
    • High-Speed Clocks on PCB
    • Special I/O Features
    • Simultaneous Switching Outputs
  • The Architecture and Packaging
    • Die - Package relation
    • User Pin Notation
    • Pin Locations overview
    • General Pin Placement issues
  • Lab: I/O Placement
  • PCB Details
    • PCB Technology
    • PCB Traces and Planes
    • Trace Characteristics
    • Layer Stackup and Rules
    • FPGA Package and Routability
  • Thermal Aspects
    • FPAG Heat Flow
    • Thermal Resistance
    • Thermal Resistance Calculation
    • Heatsink Selection
  • Lab: Thermal Design
  • Special PCB Tools
  • PCB Checklist
  • Participants should have basic experience of the XILINX design system and FPGA implementation.
 
 
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